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This is a small signal transistor package designed for surface mount applications. The formed leads absorb thermal stress during soldering, thereby eliminating the possibility of damage to the die. The encapsulation material used in this package enhances the device reliability, which allows it to exhibit excellent performance in high temperature and humidity environment.

These low to medium power packages are configured for through-hole (TO-251)or surface-mount (TO-252) applications. The leadframes for these packages have been designed to give the user the choice of either spot silver pad/copper or full nickel plate to cater to gold and aluminum wire bonding process, respectively.